Thursday, October 2
9:00 a.m. – 9:15 a.m.
Opening Remarks
Speakers: Brad Durkin, Conference Technical Director
9:15 a.m. – 9:45 a.m.
Reflections and Outlooks - Lessons Learned, Observations and Reasons for Optimism About the Future of Electroless Nickel
Speaker: Daniel Englebert, Vice President Sales and Technical Services |
Imagineering Finishing Technologies
This presentation will provide an introspective and light-hearted review of the author’s 44-year career from a job shop Electroless Nickel plating perspective. It will include a brief look back at the evolution and commercialization of electroless nickel over the past four decades. Acknowledgement will be given to some of the early pioneers and trailblazers who were instrumental in developing and advancing the technology to its current position in the market. The presentation will include lessons learned as well as a discussion of roles and responsibilities for EN suppliers, applicators and end-users. A forward-looking view of new technology and the potential future state of Electroless Nickel should provide optimism for the future of the Electroless Nickel plating industry.
9:45 a.m. – 10:15 a.m.
The Practical Questions To Ask Yourself About EN Equipment
Speaker: James Wetherald, President | Ronatec C2C
Electroless nickel plating is a cornerstone of metal finishing, but ensuring optimal performance starts with asking the right questions. This interactive Q&A session will explore key considerations for selecting, maintaining, and troubleshooting electroless nickel equipment. From bath chemistry control to tank design, filtration, and heating systems, we’ll address common challenges and best practices to maximize efficiency and coating quality. Bring your questions and join the discussion to gain valuable insights that can improve your plating operations.
10:15 a.m. – 10:30 a.m.
Message From Gold Sponsor
Refreshment Break
10:45 a.m. – 11:15 a.m.
The Chemistry of Chelation
Speakers: Travis Johnson, Technical Representative | Seacole
Chelation is how nickel metal is bound and controlled in an EN solution. These chemicals are how the deposit properties of the deposit are controlled. Understanding how these chemicals are supplied and replenished will give you a better of what goes into a solution makeup. This presentation is for those who are interested in what holds it all together.
11:15 a.m. – 11:45 a.m.
Navigating the IATF 16949 Jungle: Practical Tips for Electroless Nickel Plating
Speaker: Giacomo Bordiga, Partner & Management Team | Micron
Coatings Group
IATF 16949 is a key standard for quality and efficiency in the automotive sector and beyond, but applying it can be overwhelming, especially in niche industries like electroless nickel plating. This presentation breaks it down into simple, actionable steps, showing how to make the most of the IATF Core Tools from the perspective of an electroless nickel applicator: APQP, FMEA, PPAP, MSA, and SPC.
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This presentation aims to address the challenges of IATF 16949, providing straightforward strategies for professionals in the electroless nickel plating industry to align their operations with the standard while avoiding inefficiencies.
11:45 a.m. – 12:15 p.m.
The Potential & Future for Electroless Deposition- What's Next?
Speaker: Brad Durkin, Conference Technical Director
An article Brad originally wrote in 2017, "Evolution of Electroless Nickel Plating" published in Products Finishing that year, and in an annual Technology Handbook historically looked back at the development and growth of Electroless Nickel applications. It included a 50-year timeline of the technology platforms covering the development of what could be considered as 5 generations in Ni-P systems and applications. The most recent or significant "redevelopment" of the technology platforms occurred in the period of early 2000's when global environmental regulations impacted the use of what had been traditional chemistry additives for stabilizing systems. As a result, this youngest platform of Ni-P alloy chemistries had much improved performance and a wider range of capabilities in comparison to earlier generations. These newest systems had many realized benefits and offered extended opportunities for utilization across many industries which helped to further expand the use and promotion of Electroless Nickel.
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Fast forward, 8 years since; what else have we realized with these systems of the 5th generation platform? Have we reached a 6th generation of development, or do we continue to harvest the know-how and applications gleaned from the past 20 years? What recent patent applications and granted patents tell us about the future for Electroless Deposition? Some "crystal ball" sleuthing will be explored based on present day experience.